The 20th China copper clad technology conference was held successfully

Copper clad material by the China electronic materials industry association branch (CCLA), China electronics industry association (CPCA) copper clad branch circuit, suzhou brocade art new material technology co., LTD., China electronic copper foil material electronic materials industry association branch (CCFA), China electronics electronic fine chemical and polymer materials industry association branch (ECMA), China enterprise association of flexible copper clad laminates, printed circuit board industry association of guangdong province (GPCA), shenzhen (SPCA), the association of Taiwan PCB circuit board industry association (TPCA) supported by "the 20th China copper clad technology seminar" and "the sixth China enterprise association of flexible copper clad laminates in suzhou city, jiangsu province" suzhou rosedale spring ShenHu resort "was held successfully.

The theme of the symposium is "to adapt to the new situation, seize new opportunities, promote new level". Conference invited dozens of copper-clad r.p. panel industry and its upstream and downstream industry experts as a fascinating report, from the domestic copper clad industry and its upstream and downstream industry experts and technical staff looks good paper. It is understood that the meeting included 39 reports, papers, including technology trends, copper clad copper clad and PCB market design research and development, technology and testing, copper clad materials, environmental protection, PCB technology, etc., involved in copper clad upstream and downstream industry chain related professional, rich in content, for the industry provides valuable reference to exchange information. And in the conference, issued the "CCLA cup best paper award" of the workshop.

At present, in 5 g equipment and mobile communications, automotive electronics, intelligent manufacturing, Internet of things such as market demand, driven by China's copper clad in realizing high frequency, high speed, high thermal conductivity, high reliability, product research and development production process, continuous innovation and technical level has been rapid development. Sheet is the most core, is the most important raw materials, PCB sheet needs to be adjusted, product structure through technological breakthroughs and new market development to realize product upgrading, to join hands in creating a upstream and downstream, cooperative development, speed up the implementation of high-end, special copper clad and its localization process of raw materials.